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| (R) STPS15L25D/G LOW DROP POWER SCHOTTKY RECTIFIER MAIN PRODUCT CHARACTERISTICS IF(AV) VRRM Tj (max) VF (max) FEATURES n 15 A 25 V 150 C 0.35 V A K A K NC n n VERY LOW FORWARD VOLTAGE DROP FOR LESS POWER DISSIPATION AND REDUCED HEATSINK OPTIMIZED CONDUCTION/REVERSE LOSSES TRADE-OFF WHICH MEANS THE HIGHEST EFFICIENCY IN THE APPLICATIONS AVALANCHE CAPABILITY SPECIFIED TO-220AC STPS15L25D D2PAK STPS15L25G DESCRIPTION Single Schottky rectifier suited for Switched Mode Power Supplies and high frequency DC to DC converters (VRMS). Packaged in TO-220AC or D2PAK, this device is especially intended for use as a Rectifier at the secondary of 3.3V SMPS and DC/DC units. ABSOLUTE RATINGS (limiting values) Symbol VRRM IF(RMS) IF(AV) IFSM IRRM IRSM PARM Tstg Tj dV/dt *: Parameter Repetitive peak reverse voltage RMS forward current Average forward current Surge non repetitive forward current Repetitive peak reverse current Non repetitive peak reverse current Repetitive peak avalanche power Storage temperature range Maximum operating junction temperature * Critical rate of rise of reverse voltage Tc = 145C = 0.5 Value 25 30 15 250 1 4 9000 - 65 to + 150 150 10000 Unit V A A A A A W C C V/s tp = 10ms Sinusoidal tp = 2s square F=1kHz tp = 100s square tp = 1s Tj = 25C dPtot 1 thermal runaway condition for a diode on its own heatsink < dTj Rth( j - a ) 1/5 July 2003 - Ed : 5B STPS15L25D/G THERMAL RESISTANCES Symbol Rth(j-c) Junction to case Parameter Value 1 Unit C/W STATIC ELECTRICAL CHARACTERISTICS Symbol IR * Parameters Reverse leakage current Test conditions Tj = 25C Tj = 125C VF * Forward voltage drop Tj = 25C Tj = 125C Tj = 25C Tj = 125C Pulse test : * tp = 380 s, < 2% Min. Typ. Max. 1.3 Unit mA mA V VR = VRRM 225 IF = 15A IF = 15A IF = 30A IF = 30A 0.41 0.3 450 0.46 0.35 0.56 0.46 To evaluate the maximum conduction losses use the following equation : P = 0.24 x IF(AV) + 0.0073 IF2(RMS) Fig. 1: Average forward power dissipation versus average forward current. PF(av)(W) 8 7 6 5 4 3 2 1 0 0 2 4 6 IF(av) (A) 8 10 =tp/T T Fig. 2: Average forward current versus ambient temperature ( = 0.5). IF(av)(A) 16 = 0.05 = 0.1 = 0.2 = 0.5 14 12 10 =1 Rth(j-a)=Rth(j-c) 8 Rth(j-a)=50C/W 6 4 tp T 2 12 14 16 0 =tp/T tp Tamb(C) 50 75 100 125 150 0 25 Fig. 3: Normalized avalanche power derating versus pulse duration. PARM(tp) PARM(1s) 1 Fig. 4: Normalized avalanche power derating versus junction temperature. PARM(tp) PARM(25C) 1.2 1 0.1 0.8 0.6 0.01 0.4 0.2 0.001 0.01 0.1 1 tp(s) 10 100 1000 Tj(C) 0 0 25 50 75 100 125 150 2/5 STPS15L25D/G Fig. 5: Non repetitive surge peak forward current versus overload duration (maximum values). IM(A) 350 300 250 200 150 100 IM Fig. 6: Relative variation of thermal impedance junction to case versus pulse duration. Zth(j-c)/Rth(j-c) 1.0 0.8 Tc=25C Tc=75C 0.6 0.4 = 0.5 = 0.2 Tc=100C t 50 0 1E-3 0.2 = 0.1 T =0.5 t(s) 1E-2 1E-1 1E+0 0.0 1.0E-4 Single pulse t(s) 1.0E-2 =tp/T tp 1.0E-3 1.0E-1 1.0E+0 Fig. 7: Reverse leakage current versus reverse voltage applied (typical values). IR(mA) Tj=150C Fig. 8: Junction capacitance versus reverse voltage applied (typical values). C(nF) 5.0 F=1MHz Tj=25C 1E+3 1E+2 1E+1 1E+0 Tj=125C 1.0 Tj=25C 1E-1 VR(V) 1E-2 0 5 10 15 20 25 0.1 VR(V) 1 2 5 10 20 30 Fig. 9: Forward voltage drop versus forward current (maximum values). Fig. 10: Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, copper thickness : 35 m). (STPS15L25G only) 200.0 100.0 IFM(A) 80 Typical values Tj=150C Rth(j-a) (C/W) 70 60 50 Tj=125C 10.0 40 30 20 Tj=25C 1.0 VFM(V) 10 0 S(Cu) (cm) 0 4 8 12 16 20 24 28 32 36 40 0.1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 3/5 STPS15L25D/G PACKAGE MECHANICAL DATA D2PAK DIMENSIONS REF. A A1 A2 B D L L3 A1 B2 B G A2 2.0 MIN. FLAT ZONE V2 C R Millimeters Min. Max. 4.60 2.69 0.23 0.93 1.70 0.60 1.36 9.35 10.40 5.28 15.85 1.40 1.75 3.20 8 4.40 2.49 0.03 0.70 1.14 0.45 1.23 8.95 10.00 4.88 15.00 1.27 1.40 2.40 0 Inches Min. 0.173 0.098 0.001 0.027 0.045 0.017 0.048 0.352 0.393 0.192 0.590 0.050 0.055 0.094 0 Max. 0.181 0.106 0.009 0.037 0.067 0.024 0.054 0.368 0.409 0.208 0.624 0.055 0.069 0.126 8 A E L2 C2 B2 C C2 D E G L L2 L3 M R V2 0.40 typ. 0.016 typ. FOOT PRINT DIMENSIONS (in millimeters) 16.90 n COOLING METHOD: (METHOD C) BY CONDUCTION 10.30 1.30 5.08 3.70 8.90 4/5 STPS15L25D/G PACKAGE MECHANICAL DATA TO-220AC DIMENSIONS REF. A C D L7 Millimeters Min. Max. 4.60 1.32 2.72 0.70 0.88 1.70 5.15 10.40 14.00 2.95 15.75 6.60 3.93 3.85 4.40 1.23 2.40 0.49 0.61 1.14 4.95 10.00 13.00 2.65 15.25 6.20 3.50 3.75 Inches Min. 0.173 0.048 0.094 0.019 0.024 0.044 0.194 0.393 0.511 0.104 0.600 0.244 0.137 0.147 Max. 0.181 0.051 0.107 0.027 0.034 0.066 0.202 0.409 0.551 0.116 0.620 0.259 0.154 0.151 H2 C L5 OI L6 L2 D A E F F1 G H2 L2 L4 L9 F1 L4 16.40 typ. 0.645 typ. F G M E L5 L6 L7 L9 M Diam. I 2.6 typ. 0.102 typ. n n n COOLING METHOD : C RECOMMENDED TORQUE VALUE : 0.55 M.N MAXIMUM TORQUE VALUE : 0.70 M.N Ordering type STPS15L25D STPS15L25G STPS15L25G-TR Marking STPS15L25D STPS15L25G STPS15L25G Package TO-220AC D2PAK D2PAK Weight 1.86g 1.48g 1.48g Base qty 50 50 1000 Delivery mode Tube Tube Tape & reel n EPOXY MEETS UL94,V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics (c) 2003 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 5/5 |
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